Solder Paste Formulas for Surface Mount and General Electronic Assemblies

All Kester solder paste formulas are manufactured using the highest quality raw materials available. Kester's worldwide research facilities work together to design solder paste formulas which bring the latest technological developments to electronic manufacturers around the globe. The solder paste products listed represent the current product recommendations at the time of printing. Please contact for a specific product recommendation for your applications.



Lead-Free Solder Paste
The key variables when converting to Lead-Free SMT processes are the higher reflow temperatures, flux activity, residue characteristics, cleanability, and pin testability. The slower wetting speeds associated with Lead-Free alloys required enhanced flux systems. Kester solder paste have novel flux systems that are specfically designed for Lead-Free assembly. These new flux systems promote good wetting and excellent solder joint integrity at the higher temperatures commonly seen with most Lead-Free alloys such as SnAgCu.
Flux Type
           Formula
No-Clean
Water-Soluble


Lead Solder Paste
Flux Type
           Formula
No-Clean
Water-Soluble



Standard Alloys For Solder Paste Products
Application Alloy
Leaded Sn63Pb37
Leaded Sn62Pb36Ag2
Low Temperature (Leaded) Sn43Pb43Bi14
Lead-Free Sn96.5Ag3Cu0.5
Lead-Free Sn96.8Ag3.5Cu0.7
Low Temparature (Lead-Free) Sn42Bi58
 

          
  
   
Syringe
35 gram       10 CC
100 gram     30 CC

Solder Paste Packing Options
Jar Cartridge
250 gram 600 gram
500 gram 1000 gram
Jar are sized to fit Malcom® style viscometer.


Standard Solder Powder Distributions for Solder Paste
Powder Type Mesh Designation Typical Particle Diameter Recommended Surface Mount Application (Pitch)
Type 3 -325+500 25 to 45 micron Down to 16 mil
Type 4 -400+500 25 to 38 micron Down to 12 mil
 

 


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